Trend In AI and Liquid Cooling Technologies

• As AI workloads continue to grow rapidly, there are significant shifts in the power and cooling demands of data centers. Traditional IT racks used to run workloads of 5-10 kilowatts (kW), but with the acceleration of computing required by AI, power densities have surged. Racks with 40 kW are now at the lower end of AI deployment needs, with power densities surpassing 100 kW per rack becoming more common in the near future.

• This trend necessitates substantial capacity upgrades across the entire power chain, from the grid to each rack. Introducing liquid cooling technologies into data centers will be essential for most deployments, as traditional air cooling methods will not be able to handle the immense heat generated by AI computations.

AmpLink’s Solution:

In alignment with these evolving trends, AmpLink Tech Corp delivers cutting-edge solutions, encompassing high-density and high-capacity PDUs, advanced CDUs, and robust heavy-duty cabinets. These offerings are engineered to address the elevated power and thermal management demands of AI-optimized data centers, ensuring that facilities can efficiently navigate the complexities associated with high-density AI infrastructure.

We have factories in Thailand, in Taiwan, dedicated to providing the ultimate ODM & OEM solution for the modern data center in the AI era. A fruitful portfolio including Standard & heavy-duty EIAVserver/networing racks, with shock packaging  to support integrated rack solution. Intelligent Rack PDU and Rack/Row level CDU, manifold cooling solutions are among the offers to facilitate ultra growth of high power density demand.